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FLIR Hadron™ 640R High Performance, Dual Thermal and Visible OEM Camera Module

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FLIR Hadron™ 640R Camera Module

Hadron™ 640R pairs a performance-leading 640x512 resolution radiometric Boson® thermal camera with a 64MP visible camera in a single easy-to-integrate module. With a size, weight, and power (SWaP) optimized design, it is an ideal dual sensor payload for integration into unmanned aircraft systems (UAS), unmanned ground vehicles (UGV), robotic platforms, and AI-ready applications where battery life and run time are mission critical. The Boson longwave infrared (LWIR) thermal camera provides the ability to see through total darkness, smoke, most fog, glare as well as take the temperature of every pixel in the scene. The 64MP visible camera imagery enables AI and machine learning for intelligent sensing applications. With drivers available for market leading processors from NVIDIA, Qualcomm, and more plus industry-leading integration support, Hadron 640R reduces development cost and shortens time to market.


Size, Weight, and Power Optimized Design

INDUSTRY-LEADING THERMAL AND VISIBLE CAMERA PERFORMANCE

Collect high-speed, dual VGA radiometric thermal and HD visible imagery in all light conditions.

BUILT FOR INTEGRATORS

Reduce development cost and time to market with a solution from a single, reliable supplie

OPTIMIZE DESIGN AND OPERATION TIME WITH COMPACT, LIGHTWEIGHT, AND LOW-POWER MODULE.

The performance, reliability and support expected from Teledyne FLIR and the industry’s most versatile HD+ LWIR camera portfolio.

Specifications

Thermal Imaging Detector

Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI

Temperature Accuracy

±5°C less, over 0°C to 100°C range.

RADIOMETRY

Temperature Accuracy

±5°C less, over 0°C to 100°C range.

IMAGING & OPTICAL

EO Camera Optics

Effective Focal Length (EFL) 4.8 mm, 67° HFOV, F/# 1/2.3

EO Camera Sensor

9248 x 6944 pixels (64.2 MP), 0.7 µm pitch, 4-lane MIPI

EO Camera Video

Full resolution @ 60 Hz

IMU

ICM20602, I2C or SPI (selectable)

IR Camera Optics

Effective Focal Length (EFL) 13.6mm, 32° HFOV, F/# 1.0

IR Camera Video

Full resolution @ 60Hz

Thermal Imaging Detector

Boson 640x512 pixels, 12µm pitch, USB 3.0, 2-lane MIPI

CONNECTIONS & COMMUNICATIONS

Software Drivers

NVIDIA Jetson Nano
Qualcomm Snapdragon rb5
Qualcomm Snapdragon 865

*Contact Teledyne FLIR for latest software drivers

ELECTRICAL

Electrical Interface

Hirose DF40C-50DP-0.4V (51)
Example of mating connector: DF40HC(2.5)-50DS-0.4V (51)

Power

5V, typical power dissipation <1800 mW, Max <2900 mW

MECHANICAL

Mechanical Interface

Screw mount to back plate

Size (w/o lens)

35 x 49 x 45 mm (1.38” x 1.93” x 1.77”)

Weight

56 g

ENVIRONMENTAL & APPROVALS

Environmental Sealing

IP54 (with the rear interfaces sealed)

Operational & Storage Temperature

-20°C to +60°C

Tested EMI Performance

FCC part 15 Class B

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